Description

Description

Soldering Paste is a material use in the manufacture of printed circuit boards to connect surface mount components to the copper traces of the board. The paste initially adheres components in place by being sticky. It is then heat (along with the rest of the board) melting the paste.  And also  forming a mechanical connection as well as an electrical connection. The paste is apply to the board by silk screening and then the components are put in place by a pick-and-place machine.

When solder melts and forms a joint between two metal surfaces. It actually forms a metallurgical bond by chemically reacting with the other metal surfaces.

A good bond requires two things. A solder that is metallurgic ally compatible with the metals being bonded and good metal surfaces, free of oxides, dust, and grime that prevent good bonding. Grime and dust can easily be removed by cleaning or prevented with good storage techniques. Oxides, on the other hand need another approach.

Specifications

  • High quality
  • Lead-Free Solder Paste
  • Best for prototyping and Electronics projects
  • Efficient in Soldering of SMD components
  • Helping tool in time saving process

Packages Include:

1 × Soldering Paste

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Additional information

Weight 0.1 kg

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